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全自动激光划片机工艺
Laser scribing technology
三工激光划片/Sunic laser scribing
三工激光划片系列产品采用先进的切割工艺，可有效避免激光畸变和聚焦误差，提供更高质量的光束，划线细、精度高、加工速度快，精确控制刻槽深度，提高掰片成功率。
Sunic laser scribing series product adopt advanced cutting technology which could avoiding laser distortion and focus error effectively,providing high quality beam,slim scribing line,high accuracy,high speed,precise control of groove depth,enhance success rate of cell breaking.
绿光划片优势/Green laser scribing advantage
波长532nm绿光激光被聚焦成极小的光斑，相对于1064nm红外激光可获得更小切缝 ，更小的热影响区、切割更加整齐均匀，更高的光吸收率和更低的切割温度，能够减少切片时激光对电池片的损伤，获得更高的功率。
Wavelength 532nm green laser is focused as a extremely tiny light spot. Comparing with 1064nm IR laser, the green laser can get smaller lancing, smaller hot affected area,more uniform cutting,higher optical absorptivity and lower cutting temperature can reduce damage of laser to the cell and obtain higher power.
组件功率对比/Module power comparing
提升组件功率从选择划片机开始；
单块板平均功率高出0.8瓦， 最多高2瓦；
组件功率一致性好！
Enhance module power start with selecting scribing;
One cell average power more than 0.8w,up to 2w at most;
Module power consistency is good!
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联系人：龚女士
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